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          The United States has developed a new thermal interface material to help cool LED electronic devices.

          As electronic devices become more powerful and smaller, the heat dissipation problem becomes more and more complicated. Engineers are always looking for better thermal interface materials to help electronic devices dissipate heat.

          Polymer materials are usually thermal insulators, but the researchers in the United States through the electropolymerization process to arrange the polymer fibers in a neat array to form a new thermal interface material, the thermal conductivity is 20 times higher than the original. The new material is reliable at temperatures up to 200 ?° C and can be used in heat sinks to help dissipate heat from electronic devices in servers, automotive, and high-brightness LEDs.

          Barattid Carla, assistant professor of mechanical engineering at George Woodruff, Georgia Institute of Technology, said the new thermal interface material is made from conjugated polymer polythiophenes, and its neat nanofiber array is beneficial for phonon transfer. Also avoids the brittleness of the material. The new material has a thermal conductivity of 4.4 watts/meter Kelvin at room temperature and has been tested for 80 cycles at 200 ?°C. The performance is still stable; in contrast, the thermal interface between the chip and the heat sink is commonly used. Solder materials can become unreliable when working at high temperatures during reflow.

          The nanofiber array structure was fabricated in multiple steps: the researchers first applied the monomer-containing electrolyte to an alumina template with tiny pores and then applied an electrical potential to the template, and the electrodes in each pore attracted. Monomers begin to form hollow nanofibers. The length and wall thickness of the fibers are controlled by the amount of current applied and the time, and the diameter of the fibers is determined by the size of the pores, ranging from 18 nm to 300 nm. Conventional thermal interface materials have a thickness of from about 50 microns to about 75 microns, and new materials obtained in this manner can be as thin as 3 microns.

          Carat said that the technology still needs further improvement, but he believes that production and commercialization can be expanded in the future. a€?Suchly such highly reliable materials are attractive for solving thermal problems. This material may eventually change the way we design electronic systems.a€?

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